Zoals gisteren al poste op de IEX. Intel 'news' is geen nieuws....
Wikipedia (last update 9 augustus 2016)
xtreme ultraviolet lithography (also known as EUV or EUVL) is a next-generation lithography technology using an extreme ultraviolet (EUV) wavelength, currently expected to be 13.5 nm. EUV is currently being developed for possible future high volume use in 2020 for Intel's,[1] Globalfoundries'[2] and Samsung's [3] 7 nm node, TSMC's 5 nm node,[4] and SMIC's 14 nm node.[5] The primary EUV tool maker, ASML, projects EUV at 5 nm node to require a higher numerical aperture than currently available and multiple patterning to a greater degree than immersion lithography at 20 nm node.[6] Immersion lithography is still more than 4 times faster than EUV (275 WPH vs. 65 WPH as detailed below), due to source power limitations; hence, multiple patterning with immersion lithography has already been used where EUV had previously been expected to be used.