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[quote=Nel]
Unisem Places Order With BE Semiconductor Industries N.V. For 154 ESEC Wire Bonders
Tagged with: Asia Pacific hardware Malaysia Product/Service Semiconductor Technology
Published Monday, November 16, 2009, 10:01 (Your-Story.org)
KUALA LUMPUR, Malaysia–(BUSINESS WIRE)– Unisem (M) Berhad (Unisem) announced today that it has placed an order with BE Semiconductor Industries N.V. (Besi) for the delivery of 100 Esec wire bonders, following an order placed earlier this year for 54 wire bonders. These machines will be installed in Unisem’s high volume semiconductor assembly and test factories in Chengdu, China and Ipoh, Malaysia and will help Unisem meet its customers’ needs for increased capacity.
“We are seeing the volume demand in each of our factories continue to increase as the industry starts to recover and it is crucial that we have the equipment in place that will increase our capacity and improve our efficiency,” stated C.H. Ang, group chief operating officer and executive director at Unisem.
“This order reflects the excellent business relations we have been developing with Unisem for more than ten years. Our close collaboration already begins in the product definition phase, so that we at Besi are able to match Unisem’s requirements at an early stage,” added Richard Blickman, President & CEO at Besi.
mooie order waarom geen melding hiervan
www.your-story.org/unisem-places-orde...[/quote]
Unisem eyes IC-packaging expansion in Chengdu
(05/27/2010 9:02 AM EDT)
CHENGDU, China -- Seeking to break out from the crowded IC-packaging pack, Malaysia’s Unisem Berhad here outlined its ambitious growth strategy amid robust demand and shortages in the market.
As part of the program, IC-packaging and test specialist Unisem (Kuala Lumpur) plans to expand in China, develop an automotive expertise and look for acquisitions in the market.
To move upstream and crack new markets, the company is or will roll out higher-end packages, such MEMS, system-in-packages (SIPs), wafer-level chip-scale packages (WLCSPs) and a new leadframe array (LFA) package.
The company also has major growth plans for its various plants in China, Indonesia, Malaysia, Singapore, Wales and even the United States. But its future growth revolves around its new IC-packaging and test plant in Chengdu, the capital of Sichuan province. Chengdu also boasts a population of over 11 million people. Chengdu, a transportation and communication hub in Western China, seeks to become the next major base for the development of ICs, information technology (IT) and other sectors in the nation.
Intel Corp. owns and operates a giant IC-packaging facility in Chengdu. Semiconductor International Manufacturing Corp. (SMIC) operates a 200-mm fab in the area, but there are reports that Texas Instruments Inc. may soon take ownership of the facility.
Malaysia’s Unisem, the world’s tenth largest IC-packaging company, began production within its Chengdu plant in 2006. At present, the company is at or near capacity in the 260,000-square-foot plant. Last year, it built another 260,000-square foot facility in Chengdu, which is the phase II portion of the company’s expansion plan. Unisem plans to facilitize that plant by year’s end.
The company has three other and separate plants on the drawing board in Chendgu. Over the next five-to-ten years, Unisem plans to have five plants in Chengdu and spend some $200 million on the expansion plan here, said John Chia Sin Tet, chairman and group managing director for Unisem.
ps, wellicht dat Besi hier ook van profiteert,btw wordt tijd zoals voorgaande jaren voor een order UPdate!!!!