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quote:

windmill schreef:

@Beeldscherm

One of the techniques being applied is the through silicon via (TSV) and Schuegraf sees great potential for this. "It brings the ability to drill through a wafer and to connect them using copper studs. Now, one pin connects as many as 1000 did, but it does require a rethink on packaging. TSV allows for massive parallelisation and better bandwidth."

this is the flip chip machine machine of BESI you are referring to for the TSV application?

www.besi.com/products-and-technology/...