PRESS RELEASE
BE Semiconductor Industries Announces New RFID Orders and Swiss Development Facility
Duiven, the Netherlands, February 22, 2007, BE Semiconductor Industries N.V. ("the Company" or "Besi") (Euronext: BESI), a leading manufacturer of assembly equipment for the semiconductor industry, today announced that its Datacon subsidiary received three orders aggregating approximately US$ 3.3 million for its 8800 FC (“Flip Chip”) Smart Line die bonding system. The orders were placed by a Chinese government organization and by a Korean and American semiconductor manufacturer, respectively, for Radio Frequency Identification Device (“RFID”) applications. The orders are anticipated to be delivered in the second quarter of 2007.
Datacon’s 8800 FC Smart Line system is a fully automated, high-performance production line providing customers a complete RFID chip assembly solution based on a highly cost-effective method of direct chip attach to RFID antennae. In particular, the Chinese order was obtained via a competitive tender to help produce the enormous quantity of RFID tags required for the upcoming Beijing Olympic Games in 2008. In general, RFID technology has been defined as one of the key items in the next five year development program by the Chinese government.
In addition, Besi announced the establishment by Datacon of a new subsidiary based in Baar, Switzerland dedicated to the research and development of micromechanical systems and process technologies to help support and advance the progress of its die bonding operations. The Baar location was selected due to its proximity to the Swiss Federal Institute of Technology in Zurich and a number of Datacon’s suppliers and its high concentration of personnel nearby with expertise in process and chip technologies. The Company intends to initially lease an approximate 3,300 square foot facility and to hire between 5-10 research personnel within its first full year of operation.